SDM-1115G4L

Intel® Smart Display Module with Intel® 11th Generation Core™ i3-1115G4 Processor
  • Intel® Core™ i3-1115G4 Processor
  • Dual Channel DDR4, 2 x SO-DIMMs
  • 1 x GbE LAN Port
  • 3 x USB 3.2 Gen 1
  • 1 x USB 2.0
  • Environment : Operation 0~55°C
  • Long life time support
  • Support 4K/60Hz, HDCP v2.2

  • (For more product information, please contact us at [email protected])
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    • 11th Generation Intel® Core™ Processors
      Intel's blazing fast, feature packed processor family with built-in security is ready to take your productivity, and creativity to the next level. And, by enabling new exciting Windows 10 features, the 11th generation Intel Core processors empower you to unleash your imagination and explore the possibilities.
    • HDMI™-The Next Generation Multimedia Interface
      HDMI™ is a High-Definition Multimedia Interface which provides up to 5Gb/s video transmitting bandwidth and 8-channel high quality audio all through a single cable. Able to transmit superior, uncompressed digital video and audio, HDMI™ ensures the crispest rendering of digital content up to 1080p without the quality losses associated with analog interfaces and their digital-to-analog conversion. In addition, HDMI™ is compatible with HDCP (High-bandwidth Digital Content Protection), allowing the playback of Blu-ray/HD DVD and other protected media content.
    • SuperSpeed USB 3.0
      With superfast transfer rates of up to 5 Gbps, users are able to experience a theoretical 10x improvement over USB 2.0. Additionally, backwards compatibility with USB 2.0 assures users of long term use of their legacy USB 2.0 devices.
    • M.2 Onboard Connector
      Providing users PCI-Express connectivity for SSD devices. Delivering up to 10 Gbps data transfer speeds, M.2 offers users considerably faster storage performance than current mSATA and even SATA Revision 3 6Gbps storage devices.
    * The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
    * Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
    * All trademarks and logos are the properties of their respective holders.
    * Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

    SPECIFICATIONS

    Form Factor
    SDM-Large
    175W x 100D(mm)
    Operating Properties
    Operating temperature: 0°C to 55°C
    Operating humidity: 0-90% (non-condensing)
    Non-operating temperature: -40°C to 85°C
    Non-operating humidity: 0%-95% (non-condensing)
    CPU
    Intel® Core™ i3-1115G4 Processor
    10nm SuperFin, 2 cores, 4 threads, up to 4.10 GHz
    TDP 28W
    Socket
    1 x FCBGA1449
    Memory
    2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB
    Support Dual Channel DDR4 3200 MHz memory modules
    LAN
    1 x GbE LAN Port (Intel® I219V)
    Video
    Integrated Graphics Processor - Intel® UHD Graphics:
    1 x HDMI 2.0 (SDM), supporting a maximum resolution of 4096x2160 @60Hz
    1 x Display Port (SDM), supporting a maximum resolution of 4096x2160 @60Hz
    2 x HDMI 2.0 (Rear), supporting a maximum resolution of 4096x2160 @60Hz

    (4 independent display outputs)
    Audio
    Intel® Integrated Audio
    Expansion Slots
    1 x 2280 M.2 M-Key (PCIe x4, SATA 6Gb/s)
    1 x 2230 M.2 E-Key
    Rear I/O
    2 x HDMI
    1 x RJ45 LAN Port
    3 x USB 3.2 Gen 1
    1 x USB 2.0
    1 x PWR LED
    1 x HDD LED
    2 x External Antenna Holes (Optional)
    1 x Reset button
    1 x Power button
    TPM
    1 x TPM header
    OS Compatibility
    Windows® 10 (x64)
    Packaging Content
    Carton size: 465 x 351 x 217 (mm)
    Packing Capacity: 10pcs

    Including:
    Screw Kit with #0 ZIPLOCK BAG SCREW-BIND M3.0*L5.0 NI x 2pcs (P/N: 25KSD-130053-S0R)
    Ordering Information
    9MTGU3ALMR-SI (Box packing)
    * The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
    * Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
    * All trademarks and logos are the properties of their respective holders.
    * Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
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