H261-H61

2U 4-Node - Rear access
440 x 87 x 820

MH61-HD5

2nd Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® Scalable Processors
Dual processor per node, TDP up to 165W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Note: This device does not support Intel Omni-Path function.

Per Node:
2 x LGA 3647

Total:
8 x LGA 3647

Socket P

Intel^® C621

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
6-channel memory architecture
RDIMM up to 64GB supported
LRDIMM up to 128GB supported
Supports Intel^® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s

Maximum verified DCPMM configuration:

*Ambient temperature 35°C
*2nd Generation Intel^® Xeon^® Scalable processor 165W (Max.)
*DCPMM 256GB x2 pcs (Per Node)

DCPMM installation locations:
DIMM_P1_(G1, J1)

Note:
1. 2933MT/s for 2nd Generation Intel^® Xeon^® Scalable Processors only.
2. Intel^® Optane™ DC Persistent Memory for 2nd Generation Intel^® Xeon^® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.

Per node:
1 x 10/100/1000 Mbps Management port

Total:
4 x 10/100/1000 Mbps Management ports
1 x 10/100/1000 Mbps CMC port

Note: Please contact FAE if NCSI function of OCP mezzanine card is needed.

Integrated in Aspeed^® AST2500 x 4
- 4 x VGA ports

Per node:
2 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
4 x 2.5" SATA/SAS hot-swappable bays
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)

Total:
8 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
16 x 2.5" SAS/SATA hot-swappable bays

SAS card is required for SAS devices support

For SATA drives:
Intel^® SATA RAID 0/1/5/10

For U.2 drives:
Intel^® Virtual RAID On CPU (VROC) RAID 0/1

Note:
1) VROC module is compatible for Intel^® SSD only.
2) Default 1 PCS VROC module for one 2U 4-Node server system.

Per node:
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x PCIe x8 (Gen3 x8) low-profile slot
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth

Total:
4 x PCIe x16 (Gen3 x16) low-profile slots
4 x PCIe x8 (Gen3 x8) low-profile slots
4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth

Per node:
1 x TPM header

Per node:
1 x Power button with LED
1 x ID button with LED
1 x System status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x System status LEDs
*1 x CMC status LED

*Only one CMC status LED per system.

Per node:
2 x USB 3.0
1 x VGA
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system.

Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s

1 x TPM header with LPC interface
- Optional TPM2.0 kit: CTM000

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A

Note:
1) The system power supply requires C19 power cord.
2) 2000W 80 PLUS Titanium power supply as an option.

Aspeed^® AST2500 Baseboard Management Controller
Aspeed^® AST1250 Chassis Management Controller (-100/A00)
Aspeed^® AST2520 Chassis Management Controller (-B00)
Avocent^® MergePoint IPMI 2.0 web interface:

• Network settings
• Network security settings
• Hardware information
• Users control
• Services settings
• IPMI settings
• Sessions control
• LDAP settings
• Power control
• Fan profiles
• Voltages, fans and temperatures monitoring
• System event log
• Events management (platform events, trap settings, email settings)
• Serial Over LAN
• vKVM & vMedia (HTML5)

For Skylake processors:

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

For Cascade Lake processors:

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later

Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

8 x 80x80x38mm (16,300rpm)

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

35 kg (full packaging)

1167 x 700 x 309 mm

1 x H261-H61
8 x CPU heatsinks
1 x Rail kit
1 x VROC module
8 x Non-Fabric CPU carriers

- Barebone package: 6NH261H61MR-00-1*
- Motherboard: 9MH61HD5NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- Backplane board - CBPH0O0: 9CBPH0O0NR-NJ
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222001-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 extension card: 9CMTP01LNR-00
- Ring topology kit: 6NH23NR48SR-00