R184-S91-AAV1

Rack Server - Intel^® Xeon^® 6 Processors - 1U DP 6-Bay E1.S NVMe + 8-Bay Gen5 NVMe/SATA/SAS-4

Dual Intel^® Xeon^® 6 Processors, LGA 4710
8-Channel DDR5 RDIMM / MCR DIMM, 32 x DIMMs
Dual ROM Architecture
2 x 1Gb/s LAN ports via Intel^® I350-AM2
6 x E1.S NVMe hot-swappable bays
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
3 x M.2 slots with PCIe Gen5 x4 and x2 interface
2 x FHHL PCIe Gen5 x16 slots
2 x OCP NIC 3.0 PCIe Gen5 x16 slots
Dual 1600W 80 PLUS Titanium redundant power supply

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

1U
438 x 43.5 x 815

Motherboard

MS94-FS0

CPU

Intel^® Xeon^® 6 Processors
- Intel^® Xeon^® 6700E-Series Processors
- Intel^® Xeon^® 6700P-Series Processors (available Q1'25)
- Intel^® Xeon^® 6500P-Series Processors (available Q1'25)

Dual processor, TDP up to 350W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4710
Socket E2

Chipset

System on Chip

Memory

32 x DIMM slots
DDR5 memory supported
8-Channel memory architecture
MCR DIMM supported^[1]
RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC)
MCR DIMM: Up to 8000 MT/s

^[1]MCR DIMMs are only supported with Intel^® Xeon^® 6 Processors with P-cores and in a 1DPC configuration.

LAN

Rear (I/O board - CDCR010):
2 x 1Gb/s LAN (1 x Intel^® I350-AM2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2600
- 1 x Mini-DP

Storage

Front hot-swap:
6 x 9.5mm E1.S NVMe
- (NVMe from CPU_1)

8 x 2.5" Gen5 NVMe/SATA/SAS-4^[1]
- (NVMe from CPU_0)

Internal M.2:
2 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1

Internal M.2 (I/O board - CDCR010):
1 x M.2 (2280), PCIe Gen5 x2, from CPU_0

^[1]Storage card is required to support SATA and SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards
Onboard VROC key header

PCIe Expansion Slots

Riser Card CRS101J:
- 1 x FHHL x16 (Gen5 x16), from CPU_0

Riser Card CRS101K:
- 1 x FHHL x16 (Gen5 x16), from CPU_1

1 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Supports NCSI function

1 x OCP NIC 3.0 (Gen5 x16), from CPU_1
- Supports NCSI function

Front I/O

1 x USB 3.2 Gen1 port (Type-A)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED

Rear I/O

I/O board - CDCR010:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
2 x RJ45 ports
1 x MLAN port
1 x ID LED

Backplane Board

Speed and bandwidth:
CBP1082: PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
CBP2060: PCIe Gen5 x4

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012

1 x PRoT connector (only enabled on RoT SKU)

Power Supply

Dual 1600W 80 PLUS Titanium redundant power supply

AC Input:
- 100-127V~/ 12A, 50-60Hz
- 200-240V~/ 10A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 8A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12.2Vsb/ 3A
- Max 1600W/ 200-240V~ or 240Vdc Input
+12.2V/ 132A
+12.2Vsb/ 3A

^[Note]GIGABYTE provides PSUs with various energy efficiency ratings and power outputs. Please contact our sales representatives to determine the best configuration for your system.

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

8 x 40x40x56mm (32,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1045 x 595 x 249 mm

Packaging Content

1 x R184-S91-AAV1
2 x CPU heatsinks
1 x Mini-DP to D-Sub cable
4 x Carriers
1 x 2-Section Rail kit

Part Numbers

- Barebone package: 6NR184S91DR000AAV1*
- Motherboard: 9MS94FS0UR-000*
- 2-Section Rail kit (CMA not supported): 25HB2-3A0206-K0R
- CPU heatsink: 25ST1-4Z3201-S7H
- M.2 heatsink (2280): 12SP2-080027-00R
- M.2 heatsink (22110): 12SP2-11000E-00R
- Backplane board - CBP1082: 9CBP1082NR-00*
- Backplane board - CBP2060: 9CBP2060NR-00*
- Fan module: 25ST2-40562H-A0R
- Riser card - CRS101J: 9CRS101JNR-00*
- Riser card - CRS101K: 9CRS101KNR-00*
- EDSFF riser card - CSPP010: 9CSPP010NR-00*
- I/O board with M.2 slot - CDCR010: 9CDCR010NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-21600I-G1S

Optional parts:

- 3-Section Rail kit (Supports CMA): 25HB2-A56121-K0R
- Cable Management Arm: 25HB1-R18300-K0R

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SUPPORT

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BIOS

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版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.19975.8620

6.41 MB

Oct 08, 2024

R184-S91-AAV1

SPECIFICATIONS

SUPPORT

RESOURCES

R184-S91-AAV1